Responsibilities
1. Single process ownership in the area of mechanical wafer processing – such as backgrinding, temporary/permanent bonding, sawing, and debonding.
2. Maintain single process performance by applying statistical process control (SPC), fault detection & classification (FDC), etc.
3. Support productivity goals of our in-house production.
4. (Re-)qualification of single processes.
5. Maintain related controlled documents - e.g., control plan; Failure Mode and Effects Analysis (FMEA); Workstation Procedure (WSP); etc. & general documentation.
6. Gain and further improve in-depth single process knowledge.
7. Support single process development.
8. Identify and drive single process improvements.
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