Responsibilities
1. Process ownership in the area of mechanical wafer processing – such as backgrinding, temporary/permanent bonding, sawing, and debonding.
2. Maintain single process performance by applying statistical process control (SPC), fault detection & classification (FDC), etc.
3. Support productivity goals of our in-house production.
4. (Re-) qualification of single processes.
5. Maintain related controlled documents - e.g., control plan, Failure Mode and Effects Analysis (FMEA), Workstation Procedure (WSP), and general documentation.
6. Gain single process knowledge.
7. Support of single process development.
8. Identify and drive single process improvements.
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