Senior Staff Engineer Methodology and Software for Chip Package Board Co-Design (f/m/div)
At a glance
You want to play a strategic role in both the development of design methodologies and software solutions within our Chip Package Board Co-Design team? You will be at the forefront of enhancing our design flows while also contributing significantly to software development projects. If this sounds like the right challenge for you - join us and make an impact!
Quick info
Location: VillachEntry level: 5+ yearsJob ID: HRC0856974Start: Oct 01, 2024Type: Full timeContract: Permanent
Job description
In your new role you will:
Drive the creation and rollout of design methodologies and flows to optimize Chip, Package, Board Design tools and processes.
Collaborate between R&D, EDA vendors, and IT, streamlining tool integration and addressing software and methodology challenges.
Keep a close watch on EDA and software trends to maintain our leading edge in tools and innovation.
Deliver targeted training and support for new methodologies and tools, fostering a culture of learning and efficiency.
Have strong relationships with stakeholders, effectively translating and communicating the benefits of new tool features and methodologies.
Coordinate and align software projects with engineering principles, focusing on tool automation and enhancements.
Guide the team in adopting software best practices, from code reviews to build and test operations.
Profile
You are best equipped for this job if you have:
A university degree in Electrical, Microelectronic Engineering or Computer Science.
A strong background in EDA/PLM methodology with proven experience in design flow development and CAD project execution.
Experience with Cadence, Synopsys or Siemens EDA tools.
Knowledge of IC driven package technologies.
Software programming and scripting skills including modern software engineering practices like version control, continuous integration, and automated testing frameworks.
Experience in technical leadership and project management would be considered an asset.
Excellent verbal and written communication skills in English.
We offer competitive salaries and additional benefits based on your performance, experience, and qualification. The employment is in accordance with the collective salary and wage agreement for employees of the electrical and electronics industry, employment group H. The monthly salary is paid 14 times p.a. We offer a higher compensation depending on your expertise and skills.
About Us
Driving decarbonization and digitalization. Together.Infineon designs, develops, manufactures, and markets a broad range of semiconductors and semiconductor-based solutions, focusing on key markets in the automotive, industrial, and consumer sectors. Its products range from standard components to special components for digital, analog, and mixed-signal applications to customer-specific solutions together with the appropriate software.
The central R&D organization „Design Enabling and Services" (DES) provides the design environments (design-systems) to the different product development teams at Infineon. With leading edge design methods, complex building blocks, and a wide range of product development services, DES enables Infineon’s advanced IC development.
At Infineon in Villach you shape the technologies of tomorrow and work in an international environment with more than 4700 colleagues from over 70 nations. Your personal contribution will be valued and appreciated as the cornerstones of our success.
Contact Us
Mag. Stefanie TriebelnigRecruiterApply now
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